Bobine di leghe per saldatura

?* Informazioni su tempi di consegna e prezzi

• 

  Lega saldante senza piombo Sn99% / Ag0.3% / Cu0.7%

  HOZAN

  A cost-effective lead free solder. ■ Composition: Sn 99% / Ag 0.3% / Cu 0.7%
  
  [Features]
  · A cost-effective lead free solder.
  · Uses flux with excellent wettability, keeping any drops in workability to a minimum.
  · Even when switching from Sn-3Ag-0.5Cu solder to another type, no major changes need to be made in regards working methods or the equipment used.
  · Tin-lead solder has been used for a long time and boasts a lot of plus-points in terms of its wettability, melting point, mechanical strength, and copper leaching, etc. However, lead also has a number of unwanted effects on the environment, and as such has led to a number of lead free solder alloys being made.
  · As the melting point of lead free solder is high and the solder alloys themselves have a large specific heat capacity, this tends to result in reduced workability.

  • Sconto volumi elevati

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  Configura ora
  A partire da∗ ：	26.63 €
  Consegna da ：	6 giorni

  *Prezzo unitario in configurazione base

• 

  Lega saldante con stagno-piombo Sn50% / Pb50%

  HOZAN

  Flux Characteristics: RA Composition: Sn 50% / Pb50%
  
  [Features]
  · Can be used not only with aluminum and titanium, but also with stainless steel, nichrome, copper, brass, nickel plating, bimetal, tin-plate, steel, and many other metals.
  · Uses a water-soluble flux which can be easily removed with water.

  • Sconto volumi elevati

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  Configura ora
  A partire da∗ ：	23.86 €
  Consegna da ：	6 giorni

  *Prezzo unitario in configurazione base

• 

  Lega saldante senza piombo Sn96.5% / Ag3% / Cu0.5%

  HOZAN

  Lead free solder. Uses JEITA recommended alloys.
  
  [Features]
  · Features low-spatter flux.
  · A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.

  • Sconto volumi elevati

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  Configura ora
  A partire da∗ ：	12.93 €
  Consegna da ：	6 giorni

  *Prezzo unitario in configurazione base

• 

  Lega saldante senza piombo Sn99.3% / Cu+Ni0.7%

  HOZAN

  Lead Free Solder/Flux Characteristics: RMA Composition: Sn 99.3% / Cu+Ni0.7%
  
  [Features]
  · Lead free solder with a glossy finish close to that of tin-lead solder.
  · Solder with comparatively low rates of copper leaching and soldering iron tip damage.

  • Sconto volumi elevati

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  Configura ora
  A partire da∗ ：	28.96 €
  Consegna da ：	6 giorni

  *Prezzo unitario in configurazione base

• 

  Lega saldante con anima di fondente in resina senza piombo

  NIHONSUPERIOR

  An updated SN100C (010) product. Boasts excellent wettability. Helps prevent solder bridging and shrinkage.
  
  [Features]
  · Has great results when used for wave soldering. Suitable for the soldering of products with large usage environment loads.
  · The effects of the trace additives nickel and germanium help provide excellent workability and inhibit the generation of solder bridging and shrinkage.
  · Creates a nickel barrier, inhibiting copper leaching.
  · Is affected little by harsh conditions, helping ensure stable quality (atmospheric exposure test).
  · Features excellent growth characteristics, helping mitigate the effects of expansion and contraction resulting from heat generated by components and circuit boards.
  · Reduces the generation of dross.

  • Sconto volumi elevati

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  Configura ora
  A partire da∗ ：	96.50 €
  Consegna da ：	5 giorni

  *Prezzo unitario in configurazione base

• • In Offerta

  

  Barra Eco Solder

  SENJU METAL INDUSTRY

  A highly reliable solder bar.
  
  [Features]
  · Solder paste.
  · [Eco Solder paste].
  · "Eco Solder" is an environmentally friendly lead free solder paste that, when compared to traditional solder pastes, helps resolve problems such as heat-resistance (due to a high melting point), supply stability, wettability, and preservation stability—a problem associated with lead free solder.
  · [S70G series].
  · Maintains the viscosity stability of the GRN362 series by preservation and squeezing, while also providing improved reliability and performance in terms of heat-resistance and flux spattering. Improves in all aspects; from product mounting to production.
  · Drastically improves the ability to prevent incomplete BGA fusion, which has been difficult to solve.
  · Types which can improve the thermostability of ingredients and maintain temperature are also available.
  · [374FS series].
  · Developed for joining large surface areas such as during semi-conductor module mounting. Displays excellent cleaning properties with various types of cleaning solution. Reduces the occurrence of voids which form on the underside of bare chips, etc.
  · [TVA series].
  · A lead-free solder paste developed for usage in 3D implementation such as POP.
  · [DSR series].
  · A lead free solder paste for dispensing. Combines characteristics, enabling use with a wide range of applications.
  · As well as general reflow heating, it also supports other heating methods such as rapid heating (laser, hot air, etc.)
  · [345F series].
  · Features improved cleaning of residues with various types of cleaning solution. Boasts heat-resistance and viscosity stability while also inhibiting the formation of solder balls.

  • Sconto volumi elevati

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  Configura ora
  A partire da∗ ：	110.62 €
  	Prezzo speciale
  Consegna da ：	Stesso giorno

  *Prezzo unitario in configurazione base

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