HOZAN Bobine di leghe per saldatura

?* Informazioni su tempi di consegna e prezzi

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  Lega saldante senza piombo Sn99% / Ag0.3% / Cu0.7%

  HOZAN

  A cost-effective lead free solder. ■ Composition: Sn 99% / Ag 0.3% / Cu 0.7%
  
  [Features]
  · A cost-effective lead free solder.
  · Uses flux with excellent wettability, keeping any drops in workability to a minimum.
  · Even when switching from Sn-3Ag-0.5Cu solder to another type, no major changes need to be made in regards working methods or the equipment used.
  · Tin-lead solder has been used for a long time and boasts a lot of plus-points in terms of its wettability, melting point, mechanical strength, and copper leaching, etc. However, lead also has a number of unwanted effects on the environment, and as such has led to a number of lead free solder alloys being made.
  · As the melting point of lead free solder is high and the solder alloys themselves have a large specific heat capacity, this tends to result in reduced workability.

  • Sconto volumi elevati

  A partire da∗ ：	26.63 €
  Consegna da ：	6 giorni

  *Prezzo unitario in configurazione base

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  Lega saldante con stagno-piombo Sn50% / Pb50%

  HOZAN

  Flux Characteristics: RA Composition: Sn 50% / Pb50%
  
  [Features]
  · Can be used not only with aluminum and titanium, but also with stainless steel, nichrome, copper, brass, nickel plating, bimetal, tin-plate, steel, and many other metals.
  · Uses a water-soluble flux which can be easily removed with water.

  • Sconto volumi elevati

  A partire da∗ ：	23.86 €
  Consegna da ：	6 giorni

  *Prezzo unitario in configurazione base

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  Lega saldante senza piombo Sn96.5% / Ag3% / Cu0.5%

  HOZAN

  Lead free solder. Uses JEITA recommended alloys.
  
  [Features]
  · Features low-spatter flux.
  · A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.

  • Sconto volumi elevati

  A partire da∗ ：	12.93 €
  Consegna da ：	6 giorni

  *Prezzo unitario in configurazione base

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  Lega saldante senza piombo Sn99.3% / Cu+Ni0.7%

  HOZAN

  Lead Free Solder/Flux Characteristics: RMA Composition: Sn 99.3% / Cu+Ni0.7%
  
  [Features]
  · Lead free solder with a glossy finish close to that of tin-lead solder.
  · Solder with comparatively low rates of copper leaching and soldering iron tip damage.

  • Sconto volumi elevati

  A partire da∗ ：	28.96 €
  Consegna da ：	6 giorni

  *Prezzo unitario in configurazione base

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