Lega saldante senza piombo
Flux-less solder.
[Features]
· Has great results when used for wave soldering. Suitable for the soldering of products with large usage environment loads.
· The effects of the trace additives nickel and germanium help provide excellent workability and inhibit the generation of solder bridging and shrinkage.
· Creates a nickel barrier, inhibiting copper leaching.
· Is affected little by harsh conditions, helping ensure stable quality (atmospheric exposure test).
· Features excellent growth characteristics, helping mitigate the effects of expansion and contraction resulting from heat generated by components and circuit boards.
· Reduces the generation of dross.
[Features]
· Has great results when used for wave soldering. Suitable for the soldering of products with large usage environment loads.
· The effects of the trace additives nickel and germanium help provide excellent workability and inhibit the generation of solder bridging and shrinkage.
· Creates a nickel barrier, inhibiting copper leaching.
· Is affected little by harsh conditions, helping ensure stable quality (atmospheric exposure test).
· Features excellent growth characteristics, helping mitigate the effects of expansion and contraction resulting from heat generated by components and circuit boards.
· Reduces the generation of dross.
Codice componente
Qui sono indicati i codici componente
correlati al prodotto ricercato
SN100C-20
Informazioni di base
| Con nucleo di fondente in resina | Senza fondente | Quantità del contenuto(g) | Circa 400 | Profilo | Barra |
|---|
Configura
Proprietà di base
Filtrare per giorni di spedizione standard
-
- Tutti gli articoli
- 26 giorni o meno
Attributi opzionali
- Specifiche e dimensioni di alcuni componenti potrebbero non essere illustrate in modo esauriente. Per i dettagli esatti, consultare i cataloghi dei produttori .
Supporto tecnico
Metodo di pagamento
Produzione on demand
Certificati
Copyright © MISUMI Corporation All Rights Reserved.