Codice articolo del costruttore: BB2575B120
Marca: OKAZAKI SEIKO
Prezzo: 438.33 €
Tempi di consegna: 9 giorni
Abrasive Particles: CBN
Particle Size: 120 #
Machine Manufacturer: Waida MFG. Co., Ltd.
Supported models (applications): Profile Grinding Plate
Shape: 4B2
Codice componente
Qui sono indicati i codici componente
correlati al prodotto ricercato
BB2575B120
Codice componente
|
---|
BB2575B120 |
Codice componente |
Prezzo unitario standard
| Quantità minima d'ordine | Sconto volumi elevati | Abrasive Particles | Particle Size (#) | Machine Manufacturer | Supported models (applications) | Shape | Conditions | Outer Diameter (D) (mm) | Width of Abrasive Particle Layer (W) (mm) | Thickness of Abrasive Particle Layer (X) (mm) | Width of Abrasive Particle Layer (U) (mm) | Wheel Height (T) (mm) | Hole Diameter (H) (mm) | Angle (°) | Degree of concentration | Dimensions | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
438.33 € | 1 | 9 giorni | CBN | 120 | Waida MFG. Co., Ltd. | Profile Grinding Plate | 4B2 | Dry Type | 150 | 10 | 1 | - | 7 | 31.75 | - | 75 | 150D-10W-1X-7T-31.75H |
Loading...
Bond | Resin Bond |
---|
Configura
Proprietà di base
Tipo
Abrasive Particles
Particle Size(#)
Machine Manufacturer
Supported models (applications)
Shape
Conditions
Outer Diameter (D)(mm)
Width of Abrasive Particle Layer (W)(mm)
Thickness of Abrasive Particle Layer (X)(mm)
Width of Abrasive Particle Layer (U)(mm)
Wheel Height (T)(mm)
Hole Diameter (H)(mm)
Angle(°)
Filtrare per giorni di spedizione standard
Attributi opzionali